OnChip’s advanced wafer fabrication facility offers backside metallization (BSM) of thin films for various applications such as military, medical, and instrumentation. Back-metal is required on a wide range of Semiconductors devices to form a solderable die attach metal stack to ensure good electrical contact to the chip (ohmic contact) or proper bonding of the chips to their mounting cases. Power devices such as High Brightness Light Emitting Diodes (HB LED) require backside metal for an improved and reliable thermal conductivity. These metal layers are deposited using RF or DC sputtering and electron beam evaporation.