The demand for more power in electronics continues to increase, while the space allowable for power continues to decrease. Power densities are increasing 3X or more in many applications. This increase in power has the collateral effect of producing more heat. More heat traditionally results in the use of higher capacity fans and bigger heat sinks to prevent overheating of the electronic components and system failure. By replacing legacy power management circuits based on silicon MOSFETs and IGBTs with gallium nitride (GaN) transistor-based circuits, customers have designed power electronic systems that deliver 3X the power in the same size, or the same power in 1/3rd the size while miniturizing or completely eliminating the requirement for fans and heat sinks.