2013-06-18

DuPont Circuit & Packaging Materials Brings New Production Capability Online for CooLam®

Taiwan-based Expansion to Boost Supply of Advanced Thermal Substrates for LED Lighting   DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced today that it has increased its ability to produce and supply DuPont™ CooLam® thermal substrate products by more than seven times its previous level, to better serve its customers in the fast-growing global Light Emitting Diode (LED) lighting market.  DuPont™ CooLam® thermal substrates are designed to dissipate heat in LED lighting appli...
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Tokushima, Japan - 6 March 2024: Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, has started mass production of the new UV-B (308nm) and UV-A (330nm) LEDs in its popular 434 Series packa... READ MORE

New XLamp® S Line LEDs enhance growth, last longer, lower energy costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high efficacy and long lifetimes. Whether you are interested... READ MORE