2013-07-12

Dowcorning Introduces OE6662 Encapsulant to Promote the Development of SMD Products

In recent years, LED epitaxy and chip technology, the phosphor preparation and application, and the high thermal conductive stent technology have achieved rapid development, however, there has the following technology and new trends in the field of SMD package: high current drive, high power, medium / large size, high thermal conductivity brackets and higher requirements on lighting quality. For the new trends of LED SMD packaging market, as a global leader in silicones, silicon-based technology and innovation, Dow Corning introduced OE6662 organic silicon encapsulation ...
Continue reading

Tokushima, Japan - 6 March 2024: Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, has started mass production of the new UV-B (308nm) and UV-A (330nm) LEDs in its popular 434 Series packa... READ MORE

New XLamp® S Line LEDs enhance growth, last longer, lower energy costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high efficacy and long lifetimes. Whether you are interested... READ MORE