MIDLED package-LEDinside

Login | Register | Management | Member Center | Contact Us CN TW EN

2014-04-25

EVERLIGHT Introduces Ultra-thin 940nm IR LED in MIDLED Packaging for Higher Output Intensity

EVERLIGHT ELECTRONICS CO., LTD. introduces the ultra-thin 940nm top-view infrared LED IR92-01C/L491/2R in a miniature MIDLED package. This small SMD device has been developed for applications where high power output, narrow beam angle or available space is of concern.

Continue reading →

1 [News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards
2 [News] Samsung Celebrates the Inaugural Season of TGL Presented by SoFi: Defining a New Era of Golf
3 [News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation
4 [News] Seoul Viosys Ranked Global No.1 in UV LEDs for Six Consecutive Years
5 [News] JBD Sets a New Benchmark for MicroLED Micro-Display Technology: No More Than Three Defective Pixels per Panel—A Record Low for the Industry
6 [News] Loxo Selects Aeva to Power Autonomous Delivery Vehicles
7 [News] AUO follows Samsung, Sony Honda in Micro LED adoption

FEATURED PRODUCTS

[News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

[News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE

PRESS RELEASE