2014-06-06

Molex Releases Plastic Substrate Interconnect for LED COB Array Holders

 Molex Incorporated continues to be a leader in the Solid State Lighting (SSL) interconnect field with the addition of its Plastic Substrate Interconnect (PSI) for LED Chip-on-Board (COB) Arrays. These customizable interconnects feature a low-profile harness interface that delivers power to the array through a simple and reliable connection to a holder, or plastic substrate. With a low overall package height of ~2.00mm, Molex PSI provides a slim design for space-limited applications while minimizing substrate costs. By employing the Pico-EZmate™ harness system, the solution integrates the electrical and mechanical features with the array for a simple, solderless connection.
Continue reading

A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE