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2014-10-28

Osram: 3D LED Chip Design to become Future Technology Trend

One of Osram’s ongoing projects to overcome LED efficacy limitations is the development of microrod 3D LED technology, said Michael Schmitt, Regional Market Director, Asia-Pacific, Osram Opto Semiconductors at LEDforum 2014 which was hosted by LEDinside on Oct. 24, 2014 at Taipei, Taiwan.

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1 [News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards
2 [News] Samsung Celebrates the Inaugural Season of TGL Presented by SoFi: Defining a New Era of Golf
3 [News] Seoul Viosys Ranked Global No.1 in UV LEDs for Six Consecutive Years
4 [News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation
5 [News] JBD Sets a New Benchmark for MicroLED Micro-Display Technology: No More Than Three Defective Pixels per Panel—A Record Low for the Industry
6 [News] Loxo Selects Aeva to Power Autonomous Delivery Vehicles
7 [News] AUO follows Samsung, Sony Honda in Micro LED adoption

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[News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

[News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE

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