2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
Continue reading

Following the successful launch of the NIGHT BREAKER LED SMART ECE H11 for headlights, ams OSRAM (SIX: AMS) is continuing its series of innovative LED retrofit solutions. In addition to the new NIGHT BREAKER LED C5W ECE, the first ECE R37-appr... READ MORE

Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, today announced wins with Sparrow Quantum (Denmark) and Yeungnam University (South Korea), who have selected Veeco’s Molecula... READ MORE