| |   Management | Member Center | Contact Us RSS facebook google+ twitter linkedin mobile web     CN TW EN

Home > wafer level packaging
2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
Continue reading →
FEATURED PRODUCTS
[News] Samsung Enhances the Walmart AMP Live Event Experience with New Outdoor LED Displays

Samsung Electronics America is enhancing the fan experience at the Walmart Arkansas Music Pavilion (AMP) with an ecosystem of Outdoor LED video walls, TVs and Galaxy tablets. From the front row to the farthest corners of the outdoor venue, Sam... READ MORE

[News] Samsung Reportedly Set to Unveil 115-Inch RGB Micro LED TV in June

According to The Elec, Samsung has announced plans to launch a 115-inch RGB Micro LED TV later this year. The new model will be part of the company’s Neo QLED TV lineup but positioned as an ultra-high-end version. In contrast, current Ne... READ MORE

PRESS RELEASE