2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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A tiny Chip LED from ams OSRAM offers higher brightness, making it simply ideal for integration into everyday devices such as in-ear headphones or smart rings The enhanced Chip LED from ams OSRAM delivers higher brightness—while taking u... READ MORE

Introducing the XLamp® XP-LR & XP-GR Round LES LEDs Cree LED is redefining beam performance in portable lighting with the launch of the XLamp® XP-LR and XP-GR LEDs – designed specifically for directional lighting application... READ MORE