2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Nichia, the world's largest LED/Laser Diode manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that research findings on a circadian lighting1 environment incorporating Nichia's Dynasolis&trade... READ MORE

Celebrating its 25th anniversary this year, Absen, the global leader in LED display technology and solutions, will demonstrate the power of collaboration at Integrated Systems Europe (ISE) 2026 on stand 3M400.Together, Absen and its ecosystem par... READ MORE