2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Continue reading
Battling germs with UV-C radiation: disinfection with light is gaining global importance — in hospitals, offices, kitchens, and bathrooms. Even tap water can be disinfected using UV-C radiation. ams OSRAM has now achieved a technological... READ MORE

Samsung Electronics America today announced availability for the 115” Class Neo QLED 4K (QN90F), the latest super big screen to join the expansive 2025 Samsung TV lineup. The display delivers stunning, AI-enhanced picture quality that&rs... READ MORE