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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[News] Alternative Technologies to Low-Pressure Germicidal Mercury Lamps for Water Disinfection Applications

The prior blog titled “Nichia’s contribution to a realization of a mercury-free society” took a short break. However, there was a release about new LED-based water disinfection devices made by Miura Co., Ltd., a Japanese manu... READ MORE

[News] Ultra Narrow Beam UV LEDs with Exceptionally Focused 10° Beam for High Intensity and Collimation Applications

Violumas aims to provide the best variety of high-performance UVA, UVB, and UVC LEDs, encapsulated with the highest quality fused silica optics. The wide selection of beam angles (30°, 60°, 90°, 120°, and 135°) allows Violu... READ MORE

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