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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[News] Samsung Enhances the Walmart AMP Live Event Experience with New Outdoor LED Displays

Samsung Electronics America is enhancing the fan experience at the Walmart Arkansas Music Pavilion (AMP) with an ecosystem of Outdoor LED video walls, TVs and Galaxy tablets. From the front row to the farthest corners of the outdoor venue, Sam... READ MORE

[News] Samsung Reportedly Set to Unveil 115-Inch RGB Micro LED TV in June

According to The Elec, Samsung has announced plans to launch a 115-inch RGB Micro LED TV later this year. The new model will be part of the company’s Neo QLED TV lineup but positioned as an ultra-high-end version. In contrast, current Ne... READ MORE

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