Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.

Samsung Electronics Co. Ltd., announced today that it will demonstrate for the first time, the company's new open, secure, and connected platform for smart lighting at LIGHTFAIR International 2015, being held in New York, May 5-7.

Lighting and design professionals from around the world will converge for networking opportunities, presentations by industry thought-leaders and event experiences at LIGHTFAIR® International (LFI®)—the world’s largest annual architectural and commercial lighting trade show and conference.  LFI takes place May 3-7 at New York’s Javits Center (Pre-Conference LIGHTFAIR Institute®: May 3-4; Trade Show & Conference: May 5-7).