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2015-05-06

Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-05-05

Samsung Outlines Approach for Smart Lighting at LIGHTFAIR International 2015

Samsung Electronics Co. Ltd., announced today that it will demonstrate for the first time, the company's new open, secure, and connected platform for smart lighting at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-02-25

LIGHTFAIR® International 2015 Celebrates the International Year of Light

Lighting and design professionals from around the world will converge for networking opportunities, presentations by industry thought-leaders and event experiences at LIGHTFAIR® International (LFI®)—the world’s largest annual architectural and commercial lighting trade show and conference.  LFI takes place May 3-7 at New York’s Javits Center (Pre-Conference LIGHTFAIR Institute®: May 3-4; Trade Show & Conference: May 5-7).
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The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE

[News] Nichia's High-power 280nm UV LED Has Been Chosen by Shikoku Kakoki Co., Ltd. for Their Food and Beverage Filling Machines

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is pleased to announce that a UV-C LED disinfection device manufactured by Mutoh Industries Ltd., equipped with Nichia's high-power 28... READ MORE

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