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2015-05-12

Alpha to Present Paper on LED Die Attach Technologies at GILE 2015

Alpha, the world leader in the production of electronic soldering and bonding materials, will present a technical paper on LED die attach technologies at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th – 12th in China.

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[News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

[News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE

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