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2015-06-22

Dow Corning: CSP LED to Drive Next Generation LED Package Development

CSP technology will lead the emergence of new LED package material demands, said Kaz Maruyama, Global Marketing Director, Dow Corning Lighting Solutions at LEDforum 2015 Guangzhou, which took place earlier this month at China Import and Export Fair Pazhou Complex in Guangzhou, China.

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1 [News] Nichia's High-power 280nm UV LED Has Been Chosen by Shikoku Kakoki Co., Ltd. for Their Food and Beverage Filling Machines
2 [News] Optimized IR Lasers from ams OSRAM — Ideal for Particularly Demanding 3D Sensor Applications
3 [News] Aledia to Showcase FlexiNova at Display Week 2025 — A Customizable MicroLED Platform for Next-Gen Screens
4 [News] VueReal to Showcase Groundbreaking MicroLED Innovations at Display Week 2025
5 [News] Samsung Display Unveils Advanced R&D Achievements at Display Week 2025
6 [News] AUO to Showcase Micro LED and AI R&D Capabilities at SID 2025
7 [News] Samsung Reportedly Develops Thinnest OLED Panel for Foldable iPhone, Seals Exclusive Supply Deal

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[News] Optimized IR Lasers from ams OSRAM — Ideal for Particularly Demanding 3D Sensor Applications

The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE

[News] Nichia's High-power 280nm UV LED Has Been Chosen by Shikoku Kakoki Co., Ltd. for Their Food and Beverage Filling Machines

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is pleased to announce that a UV-C LED disinfection device manufactured by Mutoh Industries Ltd., equipped with Nichia's high-power 28... READ MORE

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