2015-06-22

Dow Corning: CSP LED to Drive Next Generation LED Package Development

CSP technology will lead the emergence of new LED package material demands, said Kaz Maruyama, Global Marketing Director, Dow Corning Lighting Solutions at LEDforum 2015 Guangzhou, which took place earlier this month at China Import and Export Fair Pazhou Complex in Guangzhou, China.
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ams OSRAM, a global leader in innovative light and sensor solutions today held a roundtable forum spotlighting new opportunities with high precision illumination characterization. The event brought together experts from industry, academia, and... READ MORE