2015-06-22

Dow Corning: CSP LED to Drive Next Generation LED Package Development

CSP technology will lead the emergence of new LED package material demands, said Kaz Maruyama, Global Marketing Director, Dow Corning Lighting Solutions at LEDforum 2015 Guangzhou, which took place earlier this month at China Import and Export Fair Pazhou Complex in Guangzhou, China.
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE