Global semiconductor capital equipment manufacturer OEM Group announced today that a leading maker of LED products has placed a repeat order for an AGHeatpulse® RTP system. The system will be used for annealing gallium-nitride (GaN) films deposited on 150mm sapphire substrates, one of the critical process steps needed in advanced LED fabrication. This repeat order validates again the AGHeatpulse® RTP system's demonstrated capabilities meeting the exacting thermal requirements of new LED manufacturing technologies, and supports the LED industry's move from batch processing of smaller diameter sapphire substrates to single wafer processing of 150mm sapphire substrates.

Global semiconductor capital equipment manufacturer OEM Group announced today it has received first-in-fab and repeat tool orders for its Cintillio™ wet chemical processing system from several leading Ultra Bright LED manufacturers working in the automotive lighting market.  With these orders, OEM Group has now successfully expanded its production proven and patented ECO-Process wafer surface preparation solutions from the established markets of Power Device, CMOS IC, and MEMS manufacturing into UBLED fabrication, a new market for Cintillio™.  The tools will be used for ozone processing of some of the most sensitive layers exposed during LED manufacturing, including exposed silver, which to date has presented LED makers with difficult challenges where surface preparation is involved.