The latest analysis “1Q17 Micro LED Next Generation Display Industry” by LEDinside, a division of TrendForce, make a further analysis on the Micro LED industry. Judging by current technology, how to transfer Micro LED will be the biggest challenge. In addition, according to current players, the technology value chain is coming into existence. Four key technologies include: the production of epi wafer for micron-size chips, the bonding of the chips, the transferring of micro-LEDs to panel substrates, and color conversion. 

The 13th China International Forum on Solid State Lighting (SSLCHINA 2016) and 3th International Forum on Wide Bandgap Semiconductors China（IFWS）were held in Beijing International Convention Center from November 15 to 18, 2016. The forums and conferences realized China’s 13th Five- Year Plan by providing strategic highlights of electronic material projects. LEDinside has summarized talks of professionals and experts in each area, including Micro LED, Laser lighting, VCSEL, Li-Fi Communication, smart lighitng and well-being lighting.

Micro-LED a light emitting diode driven by electric currents, similar to traditional LEDs in display applications it can be driven using passive matrix or active matrix. A third current driving method is the new semi-active matrix driver, which uses a completely different method compared to existing models. Below we will introduce three different circuit designs and their basic theories.