2015-09-15

Seoul Semiconductor Mass Produces Simpler Structured Package-Free LED

On September 15th at Pudong Marriott Hotel, Shanghai, China, the global Seoul Semiconductor specializing in LED (CEO Chunghun Lee,www.seoulsemicon.co.kr) announced a new product, or the new concept Wicop LED which does not need processes such as Die Bonding, Wire Bonding, etc. which were necessary for the conventional LED Package production nor main LED package component parts such as Lead frame, Gold wire, etc.
Continue reading

ams OSRAM advances its proven EVIYOS microLED technology to next-gen slow-and-wide AI optical interconnects, demonstrating ultra-low-power at high speed and moving toward product development “We industrialized microLED arrays at scale wi... READ MORE

microLEDs: from headlamps to the data center When we think about the evolution of AI technology, developments in machine learning and large language models come readily to mind, as do the latest graphics processing units (GPUs), high-bandwidth... READ MORE