On September 15th at Pudong Marriott Hotel, Shanghai, China, the global Seoul Semiconductor specializing in LED (CEO Chunghun Lee,www.seoulsemicon.co.kr) announced a new product, or the new concept Wicop LED which does not need processes such as Die Bonding, Wire Bonding, etc. which were necessary for the conventional LED Package production nor main LED package component parts such as Lead frame, Gold wire, etc.