At this week’s Meeting of the International Microelectronics Assembly and Packaging Society (IMAPS 2015), imec and CMST (imec’s associated lab at Ghent University) present a novel technology for thermoplastically deformable electronics enabling low-cost 2.5D free-form rigid electronic objects. The technology is under evaluation in Philips LED lamp carriers, a downlight luminaire and a omnidirectional light source, to demonstrate the potential of this technology in innovative lighting applications.