2016-01-19

Genesis Photonics Enters Emerging Market with Ultra-thin CSP Components at Lighting Japan 2016

Taiwanese LED manufacturer Genesis Photonics Inc. (GPI) has been developing flip chip LEDs for a long time, since 2015 the company released its flip chip integrated high power light source solution last year at Taipei AMPA 2015, which received positive feedback from the industry. In 2016, the company launched an innovative CSP components at LIGHTING JAPAN 2016 that are thinner with higher lumen per watt, enabling ultra- high efficacy of (>200 lm/W), aiming for supplying portable electronics backlights and automotive light source market (TS16949 certified) that requires high reliability.
Continue reading

A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE