RadTech 2016-LEDinside

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2016-05-26

UV Curing Market Opportunities and Challenges Observed at RadTech UV+EB 2016

In this article LEDinside will address market opportunities observed for UV curing applications at RadTech UV+EB 2016, which took place a week ago in Chicago, U.S. In this series LEDinside has covered UV LED package, epoxy resin, photoinitiator, related materials, and module applications.

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1 [News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards
2 [News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation
3 [News] Samsung Celebrates the Inaugural Season of TGL Presented by SoFi: Defining a New Era of Golf
4 [News] Seoul Viosys Ranked Global No.1 in UV LEDs for Six Consecutive Years
5 [News] JBD Sets a New Benchmark for MicroLED Micro-Display Technology: No More Than Three Defective Pixels per Panel—A Record Low for the Industry
6 [News] Loxo Selects Aeva to Power Autonomous Delivery Vehicles
7 [News] AUO follows Samsung, Sony Honda in Micro LED adoption

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[News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

[News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE

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