2016-05-26

UV Curing Market Opportunities and Challenges Observed at RadTech UV+EB 2016

In this article LEDinside will address market opportunities observed for UV curing applications at RadTech UV+EB 2016, which took place a week ago in Chicago, U.S. In this series LEDinside has covered UV LED package, epoxy resin, photoinitiator, related materials, and module applications.
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A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE