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2017-01-06

Telink Semiconductor’s RF SoC Passes ZigBee 3.0 Certification Tests

Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.
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[News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

[News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards
Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE
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