2017-01-09

Meyer Burger Ships TFE Thin Film Encapsulation System for OLED Applications to Asian Client

Meyer Burger has shipped a CONx TFE thin film encapsulation system consisting of an inkjet printer and PECVD system to an Asian customer for encapsulation of OLEDs and other flexible electronics applications. This latest order confirms the market’s recognition of Meyer Burger’s integral and fully automated thin film encapsulation system.
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The Fighting Illini turned to Daktronics (NASDAQ-DAKT) of Brookings, South Dakota, to design, manufacture and install the largest main video display in college football, totaling 17,300+ square feet. The project includes 16 LED displays that c... READ MORE

Since January 1, 2026, drivers in Spain have been required to carry certified V16 warning lights on expressways and highways, which are directly connected to the traffic authorities when in use. With the LEDguardian ROAD FLARE Signal V16 IoT, ... READ MORE