2017-05-16

DELO Introduces New Adhesive for the Optoelectronic Industry

DELO has introduced a new adhesive for optoelectronic applications. DELO DUALBOND OB786 is particularly suited for fixing components within seconds while ensuring precision and high strength. After an irradiation time of less than one second, the build-up of adhesion is already significant; after five seconds, the compression shear strength on glass even reaches 18 MPa. The adhesive also ensures good adhesion to other typical optoelectronic substrates such as aluminum, FR4, PPS, or LCP.
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What Is WICOP Technology? The Evolution of WICOP 1, 2 and 3 by Seoul Semiconductor From Package-Free Opto-Semiconductors to High-Voltage Operation and Rare-Earth-Free White Light WICOP (Wafer Integrated Chip on PCB) is a package-free opto-semi... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announced that the LDS136-152 Mobile Direct View LED Display Solution has been awarded Pro AV Best in Market Award from AV Technology, Systems Contractor News, and Soun... READ MORE