2017-11-14

Leti Demonstrates World’s First 300 mm Wafer-to-wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).
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microLEDs: from headlamps to the data center When we think about the evolution of AI technology, developments in machine learning and large language models come readily to mind, as do the latest graphics processing units (GPUs), high-bandwidth... READ MORE

The question of what makes a building "smart" has been debated in the industry for years. ams OSRAM provided a clear answer at Light + Building 2026: it is light — not as illumination, but as a sensory nervous system. It percei... READ MORE