Lumentum Holdings Inc. ("Lumentum") (Nasdaq: LITE) and TriLumina Corporation ("TriLumina") today announced that Lumentum has acquired certain technology assets of TriLumina, including its patents and other intellectual property. TriLumina technology includes innovative flip-chip, back-emitting VCSEL arrays for use in a wide range of applications, including 3D sensing, automotive safety and driver assistance systems and LiDAR, and other emerging applications. Terms of the transaction were not disclosed. (sourse:PRNewswire)...

TriLumina announced the launch of a surface-mount flip-chip back-emitting VCSEL array without the need for a submount or bond wires, allowing lower costs and higher performance than existing designs using near-infrared light-emitting laser diodes or LEDs for 3D sensing. Conventional VCSEL arrays are mounted on a submount and use bond wires for electrical connections. TriLumina’s back-emitting VCSEL technology has been flip-chip packaged and used in automotive long-range LiDAR prototypes, for low power mobile and in-cabin 3D sensing applications. (Im...

At CES 2018, TriLumina will demonstrate multiple use cases for its innovative 940 nm VCSEL illumination modules, including a novel solid-state 3D LiDAR system powered by its illumination modules, which will be showcased at the company's Suite at the Westgate Hotel as well as in the Leddar Ecosystem Pavilion.