pmdtechnologies ag is showcasing its new 3D imager IRS238XC for the first time at CES 2018. The imager has been jointly developed by pmdand Infineon Technologies AG and addresses the rapidly growing market for 3D depth sensing.

pmdtechnologies ag and Ningbo Sunny Opotech today announced a collaboration to jointly strengthen their already existing partnership. Jointly the partners develop and market 3D sensing camera solutions for mobile devices to OEMs in China and the rest of the world.

One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies the unlock-with-your-face feature becomes smarter, faster and more reliable.