2026-05-08

[News] RoboSense and Segway Navimow Are Scaling Boundary-Free Lawn Robotics

RoboSense and Segway Navimow, a Segway-Ninebot subsidiary, are scaling a new generation of boundary-free outdoor robotics. The global robotic mower market is entering a new phase of accelerated growth as intelligent outdoor automation moves further into mainstream adoption. Industry forecasts project the market to maintain double-digit annual growth over the coming years, driven by increasing demand for autonomous operation, wire-free deployment, and smarter environmental interaction. As digital LiDAR moving into broader commercialization, RoboSense and Navimow are helping...
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2026-05-08

[News] Ouster and DXOMARK Announce Strategic Collaboration on the World’s First Native Color Lidar with REV8

Ouster, Inc., a leader in sensing and perception for Physical AI, announced today its strategic collaboration with DXOMARK, a global leader in image quality evaluation and developer of advanced testing solutions. This partnership aims to test and optimize the next generation of sensing technologies, starting with the new Ouster Rev8 OS family, the world’s first native color lidar. As sensing technologies evolve toward more complex, multi-modal systems, the need for accurate, reliable, and standardized performance evaluation becomes critical. This collaboration ...
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2026-05-08

[News] Ouster Announces Results for First Quarter 2026 Share

Ouster, Inc., a leader in sensing and perception for Physical AI, announced today financial results for the three months ended March 31, 2026. “Our first quarter demonstrated strong execution across our portfolio, delivering record product revenue and validating the growing demand for our solutions across key markets. We won new million-dollar contracts for Ouster BlueCity and secured several million-dollar deals to power industrial automation. Stereolabs has already proven to be a perfect complement, and the rapid integration and commercial success of our expanded ca...
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2026-05-06

[News] Valeo to Showcase Future-Ready Trucking Innovations at ACT Expo 2026

Valeo, a leader in automotive and commercial vehicle technologies, is participating in ACT Expo, North America’s premier event for advanced vehicle technology and clean transportation. From May 4–7, 2026, at the Las Vegas Convention Center (Westhall, Booth 3242), the Group will unveil its latest technological breakthroughs designed to redefine the next decade of commercial transportation. At the Commercial Vehicle Show, Valeo is at the heart of a global industry whose production reaches 18 million units in 2025. Light commercial vehicles account for over ...
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2026-05-04

[News] Innoviz Enters Defense and Homeland Security - Enabling Physical AI-Driven 3D Situational Intelligence

Innoviz Technologies Ltd., a leading supplier of high-performance, automotive-grade LiDAR sensor platforms, today announced its entrance to the defense and homeland security (HLS) markets, with its unique solutions, InnovizSMART and InnovizTwo Ultra Long-Range (ULR) LiDAR sensors, as a suitable solution also for defense and HLS customers. Developed for civilian applications, Innoviz LiDARs' rugged design, extended detection range, and automotive-grade reliability make them well-suited for the demanding requirements of defense and security operations. ...
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2026-05-04

[News] The Car That Sees and Thinks Along: How In-Cabin Sensing Can Support Safety with OSLON™ Black IR:6 C-Series

Cars are becoming increasingly intelligent. However while driver assistance systems and sensors have long focused primarily on what happens outside the vehicle, attention is now shifting inside. In-Cabin Sensing represents a new generation of vehicle technologies designed to detect what is happening inside the car. When vehicles understand what is happening within the cabin, technology becomes a protective factor for drivers, passengers, and everyone on the road. This will be supported by the high power 940 nm OSLON Black™ IR-LEDs for camera based In Cabin applicati...
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2026-04-23

[News] Molex Adds Co-Packaged Optics Expertise with Teramount Deal

Molex, the major global electronics company, has agreed an acquisition that will give it direct access to silicon photonics technology designed to optimize co-packaged optics (CPO) and fiber connectivity with detachable photonic links. Illinois-headquartered Molex says that the deal to buy Israel’s Teramount, which should be completed by the end of June, will bring in-house the detachable, passive-alignment fiber-to-chip connectivity that is already deployed in its “one-stop CPO” solution. The technology is designed to enable faster data transfer rates...
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2026-04-21

[Insight] Touch Taiwan 2026- Micro LED Optical Communications and Interactive / Transparent Display

Touch Taiwan 2026 focuses on three main topics: Micro LED optical communications, Micro LED interactive / transparent displays, and Mini LED-backlight displays. Ennostar Ennostar is proactively implementing its dual value-added engine strategy, driving progress in scenario-based and solution-based developments. To strengthen its competitive edge in the optical semiconductor industry, “3+1” high value-added applications are highlighted, including automotive LED, advanced displays, smart sensing, and optical communications. Ennostar is accelerating its ...
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2026-04-15

[News] Now Available: Sony Electronics' AS-DT1 LiDAR Depth Sensor

Sony Electronics Inc.'s AS-DT1 LiDAR Depth Sensor is now available for purchase through authorized Sony distributors. The new miniature LiDAR depth sensor is among the world's smallest and lightest, measuring just 29mm x 29mm x 31mm (approximately 1.14 inch width x 1.14 inch height x 1.22 inch depth), excluding protrusions, and weighing only about 46g (approx. 1.6 ounces), making it ideal for space and weight-constrained applications. Housed in a compact, robust aluminum enclosure, the AS-DT1 is designed for easy integration into larger solutions, includi...
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2026-04-07

[News] CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI

CEA-Leti, a world-leading micro & nanotechnologies research institute, and CEA-List, a specialist in smart digital systems, today announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). The collaboration will leverage CEA-List's RISC-V design expertise and CEA-Leti's silicon photonics expertise to introduce high-bandwidth communication and high-efficiency computing technologies into PSMC's established 3D stacking and interposer platforms to deliver solutions for next-generation artificial intelli...
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2026-04-07

[News] Ennostar Highlights Optical Interconnects and Automation at Touch Taiwan 2026 to Drive Long-Term Growth

Ennostar Inc., through its vertically integrated optoelectronics subsidiary Ennostar Corporation, will showcase its latest innovations at Touch Taiwan 2026, highlighting two high-growth, high-value domains: datacom and sensing automation. Alongside its established strengths in Micro & Mini LED and automotive optoelectronics, the company will present a comprehensive portfolio spanning four strategic application domains. Amid accelerating trends in smart mobility, intelligent manufacturing, and high-performance computing, the optoelectronics industry is rapidly shifting fro...
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2026-04-02

[News] Ennostar Showcases Micro LED Optical Communication for High-Speed AI Data Center Interconnects with AUO and Tyntek

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In addition, Ennostar will present its high-speed Vertical-Cavity Surface-Emitting Laser (VCSEL) solutions and Continuous-Wave Distributed Feedback Laser Diodes (CW-DFB LD) for datacom, delivering a comprehensive portfolio to address diverse high-speed interconnect requirements across AI data centers. Leveraging Gro...
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2026-04-01

[News] Ennostar Partners with Ecosystem Leaders to Showcase Advanced Sensing Solutions at Touch Taiwan 2026

Ennostar, a vertically integrated optoelectronics semiconductor company, will participate in Touch Taiwan 2026 from April 8–10 under the theme “We Sense. We Connect.” The company will debut a Sensing & Automation Zone, showcasing 1D–3D sensing solutions developed with ecosystem partners and integrating optoelectronics into real-world robotics and automation, to demonstrate its system-level value enhancement strategy. Simultaneously, Ennostar will highlight its full-spectrum optoelectronic portfolio, covering LEDs, PDs, and advanced laser...
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2026-03-27

[Insight] OFC 2026 - Connecting the World

The Optical Fiber Communication Conference and Exposition (OFC) was hosted at the Los Angeles Convention Center from March 17-19, 2026. As the world’s largest annual event in optical communications, the OFC not only celebrated its 50th anniversary in 2025 but also attracted interest at OFC 2026 due to the rise of generative AI technology. This year, over 706 industry leaders from 91 countries worldwide convened, along with 115 guest speakers and more than 17,800 attendees. Together, they addressed key global issues, including quantum networking, artificial inte...
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2026-03-26

[News] ams OSRAM Showcases Blue Laser Innovations at Laser World of Photonics China 2026

ams OSRAM, a global leader in innovative light and sensor solutions today announced at Laser World of Photonics China (LWPC) 2026 a portfolio of laser products powered by its latest blue multi-mode laser chips. The company also presented, for the first time, its first high-power laser featuring multi-chip integration in a single package with single-emitter output. These innovations underscore ams OSRAM’s ongoing technological advances in the field of blue laser technology. Blue laser technology is rapidly becoming the light source of choice for industrial pre...
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2026-03-23

[News] ams OSRAM unveils ultra‑efficient microLED array for slow-and-wide AI optical interconnects and advances to product development

ams OSRAM advances its proven EVIYOS microLED technology to next-gen slow-and-wide AI optical interconnects, demonstrating ultra-low-power at high speed and moving toward product development “We industrialized microLED arrays at scale with EVIYOS™ for highly pixelated automotive forward lighting. As the leader in Digital Photonics, we are now leveraging this expertise to tackle a key bottleneck of AI infrastructure — the power required for data links between and within AI server racks,” said Aldo Kamper, CEO of ams OSRAM. ...
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2026-03-20

[News] MediaTek Develops Active Optical Cable Technology with Microsoft Research to Deliver Significant Improvements in Data Center Efficiency

A collaborative team of researchers from MediaTek, Microsoft Research, and other suppliers have successfully designed a next-generation Active Optical Cable (AOC) powered by miniaturized MicroLED light sources. This revolutionary design of an Active MicroLED Cable can significantly improve power efficiency in data centers compared to current technologies. The use of an Active MicroLED Cable would also deliver high-reliability like copper but at a much farther reach. Today’s data center networks compromise between reach, power, and reliability. Electrical...
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2026-03-20

[News] Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators

Avicena, the pioneer in microLED-based optical interconnects, today announced the LightBundle™ eKit, the industry’s first evaluation platform for microLED optical connectivity using ASIC-based transceivers with integrated LED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit enables hyperscaler, AI accelerator, high-bandwidth memory (HBM), networking, and AI infrastructure architects to evaluate next-generation optical links designed to overcome the bandwidth, reach, routing and energy limitations of copper inter...
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2026-03-20

[News] Lumentum Demonstrates Industry-Leading Technologies and Products for Scale-Out, Scale-Up and Scale-Across AI Infrastructure at OFC 2026

Lumentum Holdings Inc. (“Lumentum”), a global leader in photonic solutions, today announced its showcase of technology and product demonstrations designed to meet the accelerating demands of next-generation AI and data center infrastructure at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles. Visit Lumentum booth 1439 and connect with industry experts. Multiple demonstrations for scale-out and scale-up networking applications are being showcased: 1.6T DR4 OSFP Module with 400G Differential EMLs The 1.6T D...
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2026-03-20

[News] Coherent Demonstrates Technologies for Next-Generation Pluggable Transceiver at OFC 2026

Coherent Corp., a global leader in photonics, today announced that it will showcase a comprehensive portfolio of next-generation pluggable optical technologies at OFC 2026, spanning 1.6T, 3.2T, and emerging architectures for 12.8T and beyond. The demonstrations highlight Coherent’s multi-technology platform strategy - encompassing Silicon Photonics (SiPh), Indium Phosphide (InP), and VCSEL-based solutions - designed to enable scalable, power-efficient connectivity for AI-driven data center infrastructure. Coherent will also present multiple 1.6T transce...
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2026-03-19

[News] Marvell and Mojo Vision Collaborate to Develop Next-generation, High-density Micro-LED Connectivity Solutions

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, today announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to stretch the limits of traditional data center I/O infrastructure. To support these evolving needs, data center architects are looking for ways to more seamlessly connect large arrays of XPUs and...
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2026-03-04

[Insight] Power Consumption Reduced to 5% of Copper Cables as Micro LED CPOs Open New Path for Data Center Interconnects, Says TrendForce

The rapid rise of generative AI is driving continuous growth in demand for high-speed data transmission in data centers. Copper cable solutions, traditionally used for short-distance intra-rack interconnects, are increasingly facing challenges in both transmission density and energy efficiency. By comparison, Micro LED co-packaged optics (CPOs) offer significantly lower energy consumption per bit of data transmission. TrendForce estimates that the technology could reduce overall power consumption to just 5% of that of copper cable solutions, positioning it as a promising opt...
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2026-03-04

[News] Innoviz Technologies Expands Partnership with Dataspeed Inc. to Integrate InnovizSMART LiDAR to Drive-by-Wire Platforms

Innoviz Technologies Ltd., a leading supplier of high-performance LiDAR solutions, and Dataspeed Inc. a premier provider of drive-by-wire vehicle integration and autonomous research platforms, today announced a strategic collaboration for the distribution and seamless integration of InnovizSMART LiDAR sensors into Dataspeed's Drive-by-Wire vehicle systems for defense, agriculture, mining, automotive, and off-highway industries across North America. Dataspeed's Drive-by-Wire platforms can be integrated into autonomous offroad vehicles designed for deplo...
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2026-03-03

[News] Veeco Books Multi-System Lumina and Spector Orders for Manufacturing Indium-Phosphide (InP) based Optical Components

Veeco Instruments Inc. today announced that a global leader in optical communications laser manufacturing placed orders for multiple Lumina® Metal Organic Chemical Vapor Deposition (MOCVD) systems and multiple Spector® Ion Beam Sputtering (IBD) Optical Coating systems. These tools will be used to fabricate indium phosphide (InP) lasers for innovative optical communication solutions in the datacom industry. This order establishes Lumina as the customer’s production tool of record for InP epitaxy, while the Spector systems are used to deposit high-q...
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2026-03-03

[News] Ouster Announces Results for Fourth Quarter and Full Year 2025

Ouster, Inc., a leader in sensing and perception for Physical AI, announced today financial results for the three months and year ended December 31, 2025. “2025 was a year of exceptional execution for Ouster. Our strong revenue growth and gross margin performance are a testament to our disciplined focus as we pioneer the technologies driving the secular shift towards Physical AI, delivering record results,” said Ouster CEO Angus Pacala. “As we look forward, the strength of our digital lidar business, combined with the acquisition of Stereolabs, positio...
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2026-03-03

[News] NVIDIA and Coherent Announce Strategic Partnership to Develop Optics Technology to Scale Next-Generation Data Center Architecture

NVIDIA and Coherent Corp. today announced a multiyear strategic agreement to advance the frontier of advanced optics technologies, including manufacturing capacity and research and development, to enable next-generation AI infrastructure. The nonexclusive agreement includes an NVIDIA multibillion-dollar purchase commitment and future access and capacity rights for advanced laser and optical networking products. In addition, NVIDIA is investing $2 billion in Coherent to support research and development, future capacity and operations as Coherent builds out its ...
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2026-02-26

[News] OFC 2026 Show Floor Programs Deliver Essential Insights on Market Direction and Breakthrough Technologies

The 2026 Optical Fiber Communications Conference and Exhibition (OFC), the world’s largest annual gathering for optical networking and communications professionals, will feature show floor programming built for one purpose: giving attendees clear, actionable takeaways on today’s market realities and tomorrow’s technologies. OFC will take place 17–19 March 2026 (Technical Conference: 15–19 March) at the Los Angeles Convention Center. From analyst and investor perspectives to operator requirements and next-gen data center connectivity, thes...
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2026-02-26

[News] Innoviz Reports Fourth Quarter and Full Year 2025 Results

Innoviz Technologies Ltd., a leading Tier-1 direct supplier of high performance, automotive-grade Physical AI LiDAR sensor platforms and complementary software stack, today provided commercial and strategic updates on its business, reported its financial results for the year and quarter ended December 31, 2025, and set full year financial and operational targets for 2026. "2025 was a pivotal year for Innoviz financially and operationally. We more than doubled our revenues, delivered record gross margins, and significantly expanded programs and addressable end-markets. A...
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2026-02-24

[News] Innoviz Technologies Releases Expanded White Paper on the Rise of Physical AI and the Emergence of World Models

Innoviz Technologies Ltd., a leading supplier of high-performance LiDAR solutions, today released Part I of its new white paper, titled "Innoviz and the Rise of Physical AI: Bringing World Models to Life." This comprehensive white paper details how real-time, high-fidelity 3D perception enables the emerging class of physics-grounded AI systems and World Models. Written by Omer Keilaf, CEO and Founder of Innoviz, the white paper argues that artificial intelligence is entering a fundamentally new phase. After transforming digital systems through ...
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2026-02-23

[News] Meta and NVIDIA Announce Long-Term Infrastructure Partnership

Today, we’re excited to announce a multi-year strategic partnership with NVIDIA to advance our long-term AI infrastructure roadmap. The large-scale deployment of NVIDIA technology builds on our existing relationship and will support Meta’s build-out of data centers optimized for AI training and inference, as well as our core business. These advances will also deliver substantial improvements in performance per watt, supporting more efficient AI operations at scale. “No one deploys AI at Meta’s scale — integrating frontier research...
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Macroblock, a leading provider of LED driver ICs, is making its debut at SID Display Week, the world’s premier event for display technologies, held from May 5 to May 7. At the exhibition, Macroblock is showcasing a broad portfolio of pro... READ MORE

Philips Hue and Philips Smart Lighting (connected by WiZ) - part of Signify, the world leader in lighting - have announced the launch of Sports Live, a new software available during the Championship 2026. Sports Live uses live match data to tr... READ MORE