Cree introduces the XLamp® MH-B LED, a new generation of high-power LEDs that delivers better performance and a more-effective way to achieve low-cost systems than mid-power (MP) LEDs. Using Cree’s high-reliability ceramic package technology, the XLamp MH-B LED is able to operate at higher temperatures than MP LEDs with no reduction in rated lifetime, enabling an impressive 60 percent reduction in heat-sink size and cost. Using up to 26 times fewer LEDs than MP LEDs to achieve the same level of performance.

Alpha, the world leader in the production of electronic soldering and bonding materials in collaboration with Multek, a global supplier of rigid and flexible printed circuits, will present a technical paper on mid-power LED package assembly on PET substrates, at the upcoming 2014 SMTAI show to be held in Rosemont, Illinois.

Everlight Electronics, a leading player in the global LED and optoelectronics industry, supplements its LED Lighting product portfolio, currently featuring a market-standard CRI of >80Ra, with higher color quality versions. The new Natural Light LED variants will provide a CRI >95Ra, averaging 98Ra. EVERLIGHT is pursuing this goal a step at a time. 

Dow Corning's authorized distributor in India, Kevin Electrochem, will showcase Dow Corning's innovative and high-performance silicon-based solutions for LED lighting at Light India from September 18 to 21st 2014 in New Delhi.

Samsung Electronics reinforced its high-power LED line-up with the LH351B and the LH351Z, which have a high lumen density and are highly reliable LED packages optimized for outdoor lighting.    

Everlight Electronics, a leading player in the global LED and optoelectronics industry, announces the XI3030 High Voltage series, an addition to EVERLIGHT’s popular XI3030 mid to high power LED package. By introducing the High Voltage version, a new concept of the existing XI3030 series with higher voltages at a lower price, EVERLIGHT aims at reducing manufacturers’ total lamp or fixture costs. The XI3030 HV LED is a half to full watt LED that has a 30V version available, with other voltages upon request.

The new Oslon Black SFH 4715A boasts a typical electro-optical efficiency of 48 percent – a figure never before achieved with opto-electronic elements – and thanks to the associated huge reduction in cooling requirements, it has a much longer service life, too. In other words, this latest member of the infrared LED (IRED) family is reaching previously unattainable figures. But this is not the only new product in the Oslon Black family from Osram Opto Semiconductors: The SFH 4716A has a beam angle of 150° permitting particularly narrow-angled imaging for camera-based lighting applications by using reflector optics.

Chinese LED package manufacturers sales performance in 2013 was mediocre, the LED package market value was up slightly by 16 percent due to plunging prices, according to the latest “2014 Chinese Package Industry Market Report” by LEDinside, a research division of TrendForce. 

Oslon Square offers impressive efficiency at moderate cost The new luminaire “HighStick” from FuturoLighting is the result of successful cooperation between the Slovakian supplier of LED lighting solutions and Osram Opto Semiconductors. The Oslon Square LED from the German manufacturer offers excellent luminous efficacy as well as long life even at high temperatures and is used as light source for this luminaire from FuturoLighting which has been designed specifically for use in industry.

Lextar Electronics, a vertically-integrated LED company from Taiwan, will showcase its COB (Chip-on-Board) "Nimbus" series that feature high CRI (90), LM-80 quality and Hot Color Targeting (see note 1). The Company will also release Flip Chip COB : "Nimbus-P" series. Lextar has deployed the widest COB product line in the industry and it will debut this new COB collection at 2014 Guangzhou International Lighting Exhibition starting from June 9th in Guangzhou, China.

Everlight Electronics , a leading player in the global LED industry, puts its three decades of experience in optoelectronics in developing LED components into the new Argus series fog light source. This product is capable of providing a clear forward visibility when driving in dense fog or heavy downpour. Combined with the color temperature of sunlight (5600K), the LED front fog light increases the driver’s ability to perceive contrasts. The Argus series combined fog light and daytime running light module will be showcased in the 2014 Guangzhou International Lighting Exhibition.

The new Seoul Semiconductor Acrich 3 replaces standard Dimmable AC/DC LED drivers with 6x6mm Acrich IC - Reduces component count and improves reliability in building Smart Lighting - Remarkably improved compatibility with existing TRIAC dimmers - Interfaces with various Smart lighting control technologies 

Samsung Electronics Co., Ltd. today announced that it has improved the light quality of its LED packages and modules based on a 90 CRI (Color Rendering Index) for use in advanced lighting applications. Samsung is showcasing these LED components at the LIGHTFAIR International trade show exhibition being held here from June 3rd through 5th.

This new Acrich technology has been optimized for street and area lighting applications that require high light output, reliability, and high cost performance. 

As the market acceptance of LED is gradually increasing, there are more and more areas where LED lighting can be applied. The Taiwanese leading brand of LED packaging, Edison Opto, has recently launched various high CRI and special light series products to branch out into special lighting market. Edison Opto will participate in the 2014 Guangzhou International Lighting Exhibition and showcase their latest LED products. It is expected that Edison Opto will attract the attention of customers and the lighting industry.

Cree introduces the new XLamp® XM-L2 EasyWhite® LED, delivering more than 1,100 lumens of color-consistent light from a 5mm x 5mm package and enabling a 38 percent gain in light output and efficacy as a drop-in upgrade to the first-generation XM-L EasyWhite LED. Built on Cree’s EasyWhite technology, which combines the industry’s tightest color binning and intense light output from a single LED, the XM-L2 EasyWhite LED is optimized to replace halogen technology.

Due to aggressive market competition in the LED backlighting market, Taiwanese LED manufacturer UPEC Electronics announced termination of its LED backlight package manufacturing business recently, according to a UDN Evening News report. 

LED price for lighting applications have dropped around 3-7 percent in 2Q14. Similarly, backlight-use LED prices have also seen a decline, dipping around 5-10 percent, with direct-type TV backlight-use LEDs decreasing by 13 percent due to fierce market competition, according to the recent price report from LEDinside, the green energy research division of TrendForce.

Earlier this week, a securities firm reported that several areas in China will begin raising LED chip prices in May due to recent adjustments to the LED chip market infrastructure in China. The report continued that the supply shortage is anticipated to intensify, which will cause a price hike in all LED chips. LEDinside reporters questioned several Chinese chip and package manufacturers to see if this is truly the case. 

Boards for high power UV LED applications such as UV curing, 3D printing, maskless lithography, photodynamic therapy, and fluorescence excitation in life science or machine vision. LumiBright UV Boards offer maximized heat and current spreading to deliver high UV optical power with superior thermal management and open platform flexibility that provides for totally unique and compact UV LED design solutions.

New XNOVATM Mid Power LEDs ideal for replacement lamps and luminaires Frankfurt, Germany, Light + Building, (March 28, 2014) ‐ Luminus Devices Inc., a global manufacturer of high‐performance LEDs, announced today the release to mass production of the new XNOVA line of mid-power LEDs developed for the general lighting market.

Taiwan Semiconductor Lighting Company (TSLC) is developing packaging based on hybrid technology for wavelengths that range from UV lights with invisible short wavelengths to visible light with long wavelengths of blue, green, red, and IR. Most of the company’s products are packaged on ceramic substrates and they have control over various ceramic substrate layout technology. 

With newly improved efficacy and precise optical control, the LUXEON Z ES is now an even better choice for applications requiring tight beam angles such as spotlights, downlights, retrofit lamps and outdoor streetlights.

LG Innotek (CEO: UB Lee)announces the release of  a new high power LED technology, with a 30% lumen efficacy improvement over its previous products.

For the first time, Osram is offering a chip-on-board LED, the Soleriq P 9, which is suitable for compact powerful spotlights such as the ones used in retail outlets and museums. The latest member of the Osram Soleriq family produces 2000 lumen from a surface with a diameter of only nine millimeters. Compared with the existing Soleriq S 13, that is twice as much light from an area half the size. Just one of the new light emitting diodes is enough to replace a 35 W HID lamp for spotlighting.

SemiLEDs Corporation /quotes/zigman/119318/delayed/quotes/nls/leds LEDS +6.25% , a global provider of vertical LED technology solutions, today announced sampling and volume availability of the EV-W series of white LED chips, providing LED packagers with a vastly increased range of capabilities while lowering production costs. The new EV-W chips incorporate SemiLEDs' proprietary ReadyWhite(TM) phosphor technology, which delivers a highly uniform phosphor coating across the emitter surface, greatly increasing color precision and uniformity. 

MLS Lighting signed an order of RMB 1.42 billion (US $232 million) with 44 providential and regional dealers in China on Feb. 22, 2014. 

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, introduced a range of leading-edge LED component solutions today for use in advanced mobile devices such as smartphones and tablets.

The LED industry has been in a slump for the past 2-3 years, but 2013 marked a turning point. Rise in LED lighting demands brought new opportunities for the industry, but low price and low cost trend caused many manufacturers to incur losses and struggle financially. LED chip manufacturers with high capital expenditures were the most affected, with many still stuck in the situation. Chip scale packaging (CSP) products are the industry's latest attempt to lowering costs, as the technology is able to eliminate wiring bonding and lead frames during the production process. The product has become a hot topic in the industry upon its release. With improving CSP products technology and rising market acceptance, CSP developments in 2014 are highly anticipated by the industry.

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has raised the light efficacy for its chip-on-board (COB) family of LED packages to the highest in the industry. Samsung’s LC013B, LC026B and LC040B feature a compact light emitting surface (LES) with high light output that is designed for use in high performance LED products.