2019-02-01

Foldable PeLED and 3D Image Sensing Core Chip Developed by Korean Research Teams

Researchers at the Ulsan National Institute of Science and Technology (UNIST) and the Korea Advanced Institute of Science and Technology (KAIST) have achieved new technology developments including foldable flexible perovskite LEDs and a core chip for 3D image sensors respectively, reported BusinessKorea. The research team at UNIST announced that it has developed foldable perovskite LEDs (PeLED) with a transparent material as electrode of the device. PeLED uses perovskite material as light emitting layer through electricity. In the study, resear...
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE