Bolite Unveils Laser-based Side-wiring Solution for Panel-tiling and Thin Bezel Display Applications that offers low-resistance wrap-around wires for seamlessly tiled displays Hsinchu, Taiwan: Bolite Co., Ltd., a laser micromachining subsystem and equipment manufacturer, today announced the Bolite SW-L laser-based, automated side-wiring system, which provides wrap-around wires on the sides of the display panels to connect Micro LEDs to the drive ICs. Supporting various panel sizes and featuring high-precision alignment, advanced process control, and full auto...

3D-Micromac announced a new microLED mass transfer tool, called microCETI. The company says its new technology can be used to transfer over 130 million microLEDs per hour. <iframe allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture" allowfullscreen="" frameborder="0" height="315" src="https://www.youtube.com/embed/NjYhaYqIp74" title="YouTube video player" width="560"></iframe> MicroCETI is based on a laser-induced forward transfer (LIFT) process that can support almost any microLED material and shape...