2022-02-24

Bolite Unveils Laser-based Side-wiring Solution for Panel-tiling and Thin Bezel Display Applications

Bolite Unveils Laser-based Side-wiring Solution for Panel-tiling and Thin Bezel Display Applications that offers low-resistance wrap-around wires for seamlessly tiled displays Hsinchu, Taiwan: Bolite Co., Ltd., a laser micromachining subsystem and equipment manufacturer, today announced the Bolite SW-L laser-based, automated side-wiring system, which provides wrap-around wires on the sides of the display panels to connect Micro LEDs to the drive ICs. Supporting various panel sizes and featuring high-precision alignment, advanced process control, and full auto...
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2021-07-05

3D-Micromac Launches A New MicroLED LIFT Mass Transfer Tool

3D-Micromac announced a new microLED mass transfer tool, called microCETI. The company says its new technology can be used to transfer over 130 million microLEDs per hour. <iframe allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture" allowfullscreen="" frameborder="0" height="315" src="https://www.youtube.com/embed/NjYhaYqIp74" title="YouTube video player" width="560"></iframe> MicroCETI is based on a laser-induced forward transfer (LIFT) process that can support almost any microLED material and shape...
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From June 10 to 12 in Amsterdam, GreenTech visitors can explore how the latest-generation LED and sensor solutions from ams OSRAM enhance plant growth, save energy, and promote sustainable farming. At Hall 05, Booth 05.357, attendees will expe... READ MORE

The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE