ASM AMICRA Microtechnologies GmbH (“ASM AMICRA”) has announced three new manufacturing systems that combine X-Celeprint's Micro-Transfer Printing (MTP) and ASM AMICRA's high precision die bonding technology to introduce the complete system to enable high volume heterogeneous integration of ultra- thin dies onto up to 300mm base wafers. X-Celeprint's MTP process stacks ultra-thin dies known as 'x-chips', which can be extremely varied[1] and made using very different process nodes and technologies[2], to create virt...