2022-05-25

Showa Denko's Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO's Green Innovation Fund Projects

TOKYO, May 24, 2022 - (ACN Newswire) - Showa Denko (SDK) (TOKYO: 4004) proposed its "Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors(1)" (hereinafter "the Project") to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for "Projects to Develop Wafers Technology for Next-generation Power Semiconductors" which was set as a research and development target of "Next-generation Digital Infrastructure Construction(2)" in "Green...
Continue reading

A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE