2022-11-24

KYOCERA Develops New GaN Laser Chip, World’s Smallest* to be Mass-Produced from Silicon Working Substrate

(a) 100 Micron Long Laser Developed by Kyocera, (b) Micro LED Substrate, and (c) 100 Micron Long Laser (Graphic: Business Wire) Company unveils new process to create functioning 100 micron length micro-light sources with higher yield, lower cost — enabling short cavity lasers and micro-LEDs for autonomous driving, AR, and VR applications KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Hideo Tanimoto)(TOKYO:6971) has developed a new thin-film process technology for making unique silicon (Si) substrates for gallium...
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Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, today announced wins with Sparrow Quantum (Denmark) and Yeungnam University (South Korea), who have selected Veeco’s Molecula... READ MORE

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), and SANlight GmbH, Schruns, Austria, today announced a partnership under which SANlight will use Cree LED’s J Series® products in its new STIXX-Series luminaires. Developed for appl... READ MORE