2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
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WG Tech recently held an in-depth online discussion with Dr. Adi Abileah, former Chief Scientist at Planar Systems and a SID Fellow, to exchange insights on glass substrate based MiniLED technology innovation. Dr. Abileah, a globally respected... READ MORE

Signify, the world leader in lighting, launches Puzzle – the first luminaire of its kind to combine striking, continuous light with office compliance, task-ready performance and a breakthrough in sustainable design using 75% recycled PET... READ MORE