Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technologies with Lumentum’s VCSEL-based optical interconnect platform and Corning multimode fiber connectivity. Attendees can see the demonstration at Lumentum stand #2050 and at...

Lumentum Holdings Inc. (“Lumentum”) today announced its plan to demonstrate an eight-wavelength dense wavelength division multiplexing (DWDM) laser module in an External Laser Small Form Factor Pluggable (ELSFP) at ECOC 2026. The module incorporates an optical interface designed to meet the applicable requirements of the Optical Compute Interconnect Multi-Source Agreement (OCI MSA). It is intended for external laser source applications in co-packaged optics (CPO) and near-packaged optics (NPO) architectures. Attendees can see the demons...

From October 12 to 18, 2026, Valeo will be at the Paris Motor Show (Hall 5.3, Booth 53A51) to present its latest innovations designed to accelerate the automotive industry’s transformation. As vehicles are increasingly defined by technology and embedded intelligence, Valeo stands out as the key partner capable of scaling cutting-edge technologies for automakers while addressing major challenges for more safety, sustainability, electrification and software integration. Christophe Périllat, Chief Executive Officer of Valeo, said: “This Paris Motor Sho...

Micro LED optical interconnect technology emerged as a focal point during CIOE (China International Optoelectronic Exposition) 2026. A wide range of ecosystem players—from epitaxy, chip, and display module providers like Enkris Semiconductor, LEKIN, Starksemi, and Raysolve, to system architecture vendors such as Nexilumen (Shanghai) and Intelligence Computing Optical Interconnects (An affiliated company of Wuhu Token Science)—showcased their latest breakthroughs in Micro LED optical interconnect solutions. From an architecture perspec...

Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro LEDs. The architecture features semiconductor dies embedded directly into a glass substrate, where Through-Glass-Via (TGV) within the substrate deliver power straight to the Micro LEDs on the dies. The power and signal connections are then routed to the mainboard via a package substrate. According to the patent, the Micro LEDs can utilize nanowire structures to emit red, green, and blue (RGB) light. Potential applications include pe...

ECOC 2026, the European Conference on Optical Communications, has been taking place this week in Málaga, Spain. Researchers from both industry and academia and professionals came together to discuss and explore advances in optical communications. The conference program covered all aspects in the field of optical communications and networks, including emerging fields such as Artificial Intelligence, the Internet of Things, and Quantum Technologies. optics.org has here gathered together a selection of notable launch announcements: Avicena, a developer of microL...

Moving data efficiently is becoming one of the defining challenges of next-generation AI systems. As AI clusters continue to scale, optical interconnects are emerging as critical technology for enabling higher bandwidth at significantly lower power consumption. Expanding ams OSRAM's Digital Photonics Interconnects platform into AI scale-up through a growing ecosystem of industry partners Introducing next-generation 850nm Thin-Film microVCSEL arrays with addressability enabling highly parallel "wide-and-slow" optical architectures Demonstra...

ams OSRAM wide-and-slow architecture for scale-up, scale-out and future chip-to-chip use cases in AI data centers.<iframe allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share" allowfullscreen="" frameborder="0" height="315" referrerpolicy="strict-origin-when-cross-origin" src="https://www.youtube.com/embed/Q1iY4FfBu9A?si=z-Cz_Rdml6ZOMCMG" title="YouTube video player" width="560"></iframe>Micro-array technology for higher-density AI interconnects Can your datacom architecture keep pace with rising...

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced it will showcase its latest optical and high speed connectivity technologies at the European Conference on Optical Communication (ECOC) 2026, taking place September 21 - 23, 2026, in Málaga, Spain. Visitors to Stand 1055 can learn about MACOM’s broad portfolio of solutions designed to support the growing bandwidth, performance and power efficiency demands of AI infrastructure, cloud data centers, telecommunications networks and eme...

Ouster, Inc., a leader in sensing and perception for Physical AI, today announced surging customer momentum for its Rev8 OS1 Max native color digital lidar, with payload integrators and drone OEMs across the aerial mapping market selecting the sensor for utility corridor inspection, infrastructure management, and defense applications. Aerial mapping teams have long worked around the same constraint: fly low enough to resolve a power line and a single mission covers a fraction of the corridor; fly high enough to cover ground and the thin objects that matter most start to di...

Vuzix® Corporation, a leading supplier of AI-powered smart glasses, waveguides and augmented reality technologies, today announced that it has begun shipping its first Causeway™ waveguide bridge samples to select prospective customers and ecosystem partners, and is making a broader optical interconnect evaluation kit available for AI data center optical interconnect applications, including co-packaged optics (CPO) architectures. Industry forecasts point to significant growth in this emerging market. TrendForce forecasts that the combined co-packaged optics and near-...

ams OSRAM today unveiled its imaging-to-display sensing solution for smartphones at the 2026 China International Optoelectronic Exposition (CIOE 2026). The solution integrates ams OSRAM's latest-generation sensing technologies to help smartphones achieve greater accuracy, stability, and precision in ambient light detection, image capture, and spatial sensing. By connecting the sensing technologies across the imaging-to-display pipeline, it helps mobile devices deliver a visual experience that is true to life. This newly launched solution integrates an ams OSR...

Ouster, Inc., a leader in sensing and perception for Physical AI, and Flyability, a pioneer in confined-space inspection and mapping, will showcase their long-standing technology collaboration at INTERGEO 2026, taking place September 15–17 in Munich, Germany. Flyability will join Ouster at Booth B5I018 in Hall B5, where the companies will demonstrate how the combination of Flyability’s collision-tolerant Elios 3 drone and Ouster’s digital lidar enables industrial teams to capture accurate 3D data in environments that are difficult to access wi...

During its Investor Open Day on August 28, TCL Technology detailed its strategic layout in optical communications for the first time. TCL’s management noted that the optical communications industry is on the verge of major development opportunities. The company expects to execute its roadmap following the sequence of “optical chips → optical components → optical modules.” In the optical chip segment, TCL stated that it has already established a foundational capability. Through the acquisition of the Fuzhou Huazhao, TCL secured techn...

Ouster, Inc., a leader in sensing and perception for Physical AI, announced a strategic partnership with GeoCue, a premier provider of drone mapping payloads and software, to integrate Ouster’s native color Rev8 OS1 Max digital lidar into GeoCue’s TrueView product line. The collaboration pairs GeoCue's TrueView 1 payloads and LP360 software with Ouster's digital lidar to deliver survey-grade data to the utility and infrastructure industries. GeoCue is expanding its TrueView lineup to include options featuring the Ouster Rev8 OS1 Max,...

Sense the power of light CIOE is the world’s leading optoelectronic and annually held in Shenzhen, China, covering various topics including precision optics, lens & camera module, lasers technology, infrared applications, optoelectronic sensor, photonics innovations and so on. As a global leader in digital photonics, ams OSRAM pioneers advanced light and sensor solutions. Our commitment to pushing the boundaries of illumination, visualization, and sensing has earned us the trust of customers worldwide. Together, we create break-through applications that make our ...

As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry growth. Targeting key technologies at the forefront of AI infrastructure, AUO will showcase its latest advancements in optical communications and advanced semiconductor packaging at SEMICON Taiwan 2026, taking place September 2-4. At the booth of AUO Group company Daxin Materials (L1210), AUO will present an optical communication solution featuring a system-level M...

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today reported financial results for the second quarter of fiscal year 2027. Net revenue for the second quarter of fiscal 2027 was $2.739 billion, $39.0 million above the mid-point of the Company’s guidance provided on May 27, 2026. GAAP net income for the second quarter of fiscal 2027 was $308.0 million, or $0.33 per diluted share. Non-GAAP net income for the second quarter of fiscal 2027 was $865.9 million, or $0.94 per diluted share. Cash flow from operations for the second quart...

Ouster, Inc., a leader in sensing and perception for Physical AI, today announced that GUSS Automation, a wholly owned John Deere Subsidiary and a pioneer in autonomous high-value crop operations, plans to incorporate Ouster’s Rev8 OS0 native color digital lidar sensors, powered by the breakthrough L4 Ouster Silicon, into the next generation of its Autonomous Orchard Machine Fleet. The integration is expected to further expand machine capabilities while underscoring the role of advanced sensing technologies in helping autonomous agricultural machines operate...

For decades, vehicle safety has been defined by technology for the exterior. Engineers have focused on helping vehicles detect pedestrians, recognize road signs, monitor traffic, and avoid collisions. Cameras, radar, and LiDAR have transformed the way vehicles perceive their surroundings. But a crucial safety zone was mostly overlooked: the vehicle interior. That is changing rapidly. With the EU General Safety Regulation (GSR) now fully in force for all newly registered passenger cars, trucks, and buses since July 2026, monitoring what happens inside the cabin has be...

Avicena, the pioneer in microLED-based optical interconnects, today announced that it has begun shipping 1 Tbps LightBundle™ evaluation kits (eKits) to customers and partners developing next-generation AI infrastructure. The shipment milestone follows the introduction and demonstration of the LightBundle eKit in March 2026 at the Optical Fiber Conference (OFC26) and advances the platform from initial evaluation availability to terabit-class operation in customer laboratories. The latest LightBundle eKit incorporates a 335-channel microLED array, with each...

ECOC: Driving optical interconnect innovation for AI data centers ams OSRAM combines expertise in micro-emitters, micro-photodiodes, CMOS and advanced packaging to enable integrated optical solutions for the next generation of AI infrastructure. At ECOC 2026, we show how our “wide & slow” architecture addresses the rising bandwidth density and reach challenges in AI data centers. Combining ams OSRAM’s groundbreaking micro-array technology with system-level co-optimization, we enable scalable, cost-effective and energy-efficient optical...

SK hynix is moving from a memory supplier to a bigger role in the AI infrastructure. According to the company, it has teamed up with leading researchers worldwide to lay out a roadmap for co-packaged optics (CPO) in the journal Nature Electronics. Notably, beyond its HBM leadership, SK hynix’s paper tackles data bottlenecks at the rack and pod levels, outlining an optics-centric architecture that links memory and processors through optical interconnects. As hyperscale AI clusters scale to thousands of GPUs and HBM stacks, conventional copper links are ...

Coherent Corp., a global leader in photonics, announced financial results today for its fiscal fourth quarter and full year fiscal 2026 ended June 30, 2026. Revenue for the fourth quarter of fiscal 2026 was $2.05 billion, with GAAP gross margin of 38.5% and GAAP net income of $1.19 per diluted share. On a non-GAAP basis, gross margin was 40.2% with net income per diluted share of $1.74. “Fiscal 2026 was an outstanding year for Coherent, with record revenue, significant margin expansion, and non-GAAP EPS growth that was more than twice the rate of revenue...

OpenLight, a leader in heterogeneous III‑V‑on‑silicon photonic integration and custom Photonic Application‑Specific Integrated Circuits (PASICs), and Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced the availability of OpenLight’s photonic Process Design Kit (PDK) for Tower Semiconductor’s PH18DA indium phosphide (InP)-on-silicon photonics platform in Cadence’s electronic design automation (EDA) tools. Developed through close technical collabor...

Ouster, Inc., a global leader in high-performance lidar sensors and intelligent software solutions, powering Physical AI across the automotive, industrial, robotics and smart infrastructure sectors, announced today that Econolite, a leader in mobility operating systems, was awarded an expansion contract from Utah Department of Transportation (UDOT) to deploy Ouster BlueCity, a complete lidar traffic management solution for actuation, alerts, and analytics, at an additional 160 intersections statewide. With the first Ouster BlueCity with integrated Rev8 installation...

Lumentum Holdings Inc. (“Lumentum” or the “Company”) today reported results for its fiscal fourth quarter and full fiscal year ended June 27, 2026. “Lumentum is positioned at the heart of a secular industry shift. As AI compute workloads increase in both speed and bandwidth, data center architects are turning to optical links as a primary means of connectivity. While our Q4 results demonstrate broad-based traction, key growth drivers such as OCS solutions and our cloud module business, where we are advancing 1.6T adoption, are beginning to lay...

As parameter counts in generative AI models expand exponentially, single-GPU configurations can no longer meet processing demands. While clustered computing has become industry standard, it introduces severe physical limits: the Bandwidth Wall and the Power Wall. In modern AI server architectures—specifically within chip-to-chip (Die-to-Die) and board-to-board Scale-Up expansion topologies—traditional copper interconnects are rapidly hitting physical ceilings. Signal attenuation, elevated latency, and unsustainable power dissipation have sparked a clear cons...

Veeco Instruments Inc. today announced that a global leader in optical and photonic technologies has selected its LUMINA®+ Metal Organic Chemical Vapor Deposition (MOCVD) system to fabricate indium phosphide (InP) lasers for innovative communication solutions in the datacom industry. The LUMINA+ system has now been adopted across all major applications in the arsenide and phosphide (As/P) epitaxial space, including the fast-growing InP laser market. “Following a series of recent orders and qualifications, this order extends the strong position of...

Ennostar Inc. today held its earnings conference and announced its consolidated financial results for the second quarter of 2026. Consolidated revenue for the second quarter of 2026 totaled NT$6.32 billion, increasing by 20.6% quarter-over-quarter and 10.2% year-over-year. Net income attributable to parent company amounted to NT$1.25 billion, with a basic earnings per share of NT$1.69. Second-quarter results reflected improving market conditions as global demand continued to recover gradually. Customer inventory replenishment supported double-digit sequential revenue growth ac...