2026-06-05
Recently, West Lake Yanshan Technology (Hangzhou) Co., Ltd. officially commenced production at what it claims is the world’s first 8-inch GaN-on-Silicon Micro LED IDM mass production line, located at its factory in Deqing, Zhejiang Province.
The newly launched line adopts a full-chain IDM model, covering the entire manufacturing process from epitaxial material growth and chip fabrication to advanced packaging. The facility enables integrated closed-loop production from silicon-based GaN epitaxy to finished Micro LED devices.
Unlike the conventi...
Continue reading →
2026-06-04
As per South Korean media outlet ETNews on May 27, Samsung Display (SDC) is building a pilot production facility for Micro LED smartwatch displays on a 5.5-generation Quarter Cut production line at its A2 campus in Asan, Chungcheongnam-do. An industry insider said the Micro LED process equipment includes transfer, bonding, inspection, and repair systems. Samsung Display had been evaluating equipment suppliers from late last year through early 2026, with the relevant tools expected to be installed within the year. After completing the pilot facility this yea...
Continue reading →
2026-06-01
On May 26, SmartSens Technology and UNISOC announced a strategic partnership to jointly advance high-speed Micro LED optical interconnect technology. The collaboration will focus on optical interconnect chip design and system-level solutions, targeting short-reach, high-speed connectivity for AI computing clusters with domestically developed solutions featuring high bandwidth, low power consumption, and high integration. Under the partnership, both sides will develop a next-generation Micro LED CPO optical interconnect solution. Built on SmartSens’ op...
Continue reading →
2026-05-28
U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o™, is a Micro LED-based optical interconnect platform jointly developed with microdisplay company Kopin. The platform is designed to address growing bottlenecks in AI infrastructure, particularly data transfer efficiency among GPUs, accelerators, memory system...
Continue reading →
2026-05-22
Picture: Ms. Jennifer Lin, AUO Corporation Vice President of Innovation Development, and Mr. Ness Benamran, Aledia Chief Financial Officer, announced the partnership in the presence of the Minister of Economic Affairs of Taiwan, Mr. Kung Ming-Hsin AUO Corporation (“AUO”) and Aledia today announced a strategic partnership to develop a new generation of microLED display technology combining high brightness, low power consumption, and high resolution. The collaboration will integrate Aledia’s high-voltage microLED (µLED...
Continue reading →
2026-05-21
Samsung Electronics Co., Ltd. and Google today unveiled new intelligent eyewear1 at Google I/O 2026 by giving a first look at two premium styles created with eyewear partners Gentle Monster and Warby Parker. Designed to work as a companion device to a mobile phone, the new eyewear enables users to access help through voice interaction and connect seamlessly to their phones, all through a familiar form factor. Co-created with the eyewear partners, the intelligent eyewear combines breakthrough AI capabilities with comfort and style, merging Samsung’s leadership in h...
Continue reading →
2026-05-20
University of Michigan in the USA has claimed the highest external quantum efficiency (EQE) and smallest linewidth so far for red-emitting indium gallium nitride (InGaN) micro-LEDs, using photonic crystal (PhC) structures [Yuanpeng Wu et al, Light: Science & Applications v15, p133, 2026] Further, the emission wavelength was stable for a wide range of injection currents. The 5nm full-width at half maximum (FWHM) was about one order of magnitude narrower than previously reported values. The researchers see narrow linewidths as “paramount for achievin...
Continue reading →
2026-05-20
AI is pushing the boundaries of computing infrastructure to new levels as data centers scale to millions of GPUs. High-speed interconnects play a critical role in enabling this expansion with high-throughput and reliable data movement between compute, memory, and storage systems. New photonic connectivity technologies are emerging to meet the higher bandwidth requirements of GPU-dense architectures.
Credo is innovating across its product portfolio that spans diverse physical mediums, distances, and protocols to meet customer needs. Credo began investing in microLED technolo...
Continue reading →