On May 26, SmartSens Technology and UNISOC announced a strategic partnership to jointly advance high-speed Micro LED optical interconnect technology. The collaboration will focus on optical interconnect chip design and system-level solutions, targeting short-reach, high-speed connectivity for AI computing clusters with domestically developed solutions featuring high bandwidth, low power consumption, and high integration. Under the partnership, both sides will develop a next-generation Micro LED CPO optical interconnect solution. Built on SmartSens’ op...

U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o™, is a Micro LED-based optical interconnect platform jointly developed with microdisplay company Kopin. The platform is designed to address growing bottlenecks in AI infrastructure, particularly data transfer efficiency among GPUs, accelerators, memory system...

Google’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design. TrendForce’s latest research on the high-speed interconnect market indicates that this architecture will directly address the surging compute and bandwidth demands driven by large-scale AI workloads. TrendForce estimates that the global shipment share of 800G and above optical transceiver modules will climb from 19.5% in 2024 to over 60% by 2026, p...