2026-10-22
Ouster, Inc., a leader in sensing and perception for Physical AI, and Forterra, the leader in autonomous mission systems for military operations in contested environments, today announced that Forterra's Lancer autonomous ground vehicles have completed 1,426 missions and 88 casualty evacuation operations in Ukraine including Ouster Rev7 OS1 digital lidar at the core of their sensor fusion perception stack. Forterra built and delivered 105 Lancers in under six months, and across more than 7,300 miles they have run routes that would otherwise have put a crew inside the ve...
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2026-10-21
NVIDIA is advancing its next-generation co-packaged optics (CPO) technology, with prototypes designed to bring optical engines closer to computing chips. According to Wccftech, the company presented its latest optical integration research at SEMICON West 2026 under the theme “Optical Integration for the Next Generation of AI,” including an optics-on-interposer (OOI) prototype and dense wavelength-division multiplexing (DWDM) technology. The OOI design moves optical engines from the organic package substrate directly onto the silicon inter...
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2026-10-20
Intel is expanding its silicon photonics capabilities as demand for high-bandwidth optical interconnects grows across AI and high-performance computing (HPC). According to Wccftech, at the 2026 Open Compute Project (OCP) Global Summit, Intel claimed to be the only high-volume foundry capable of supplying 300mm indium phosphide (InP) silicon photonics at scale to the broader industry. The technology is intended to support next-generation near-package optics (NPO) and co-packaged optics (CPO) for AI and HPC applications. As highlighted by ijiwei, conventio...
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2026-10-20
Nexilumen, a spin-off from Fudan University, has made new progress in Micro LED optical interconnects, increasing aggregate bandwidth through space-division multiplexing (SDM) and wavelength-division multiplexing (WDM). Its 16-channel Micro LED array achieved a data rate of 37 Gbps, while a five-channel WDM solution reached a data-rate density of approximately 201 Gbps/mm². In SDM, Nexilumen uses a 4 × 4 green Micro LED array integrating 16 independently driven pixels. Each pixel delivers an average data rate of approximately 2.3 Gbps, with ...
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2026-10-18
Seyond, a global provider of LiDAR technology, will collaborate with Dell Technologies and NVIDIA on a live operational twin demonstration at Smart City Expo World Congress 2026. Presented at the Dell Technologies and NVIDIA booth, Stand 131, the joint exhibition demonstration will highlight the role of real-time spatial intelligence in smarter city and facility operations. The event takes place November 3–5 at Fira Barcelona Gran Via in Barcelona, Spain. Using three wide-field-of-view Robin W sensors and one fully solid-state Hummingbird D1R...
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2026-10-16
Smart Eye, the leading developer of DMS software for the automotive industry, has been selected to supply its DMS technology to a new customer, a Japanese vehicle manufacturer.
The nomination was secured through a collaboration with a large global Tier 1 supplier. This marks the first time the OEM sources Smart Eye’s DMS software, selecting the company’s technology for two vehicle models across its lineup, with alcohol impairment detection included as part of the DMS delivery.
The new vehicles featuring Smart Eye’s technology are scheduled to...
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2026-10-14
Industry initiative brings together hyperscalers and optical ecosystem participants to advance low-latency, cost-efficient optical interconnects for AI scale-up and scale-out networks.
Participation in the Open Compute Project (OCP) Short-Reach Micro-Emitter Optics (SRMO) workstream positions ams OSRAM within a leading industry ecosystem shaping optical connectivity standards for next-generation AI infrastructure
ams OSRAM’s microLED, microVCSEL and microPhotodiode capabilities provide a differentiated and scalable technology platform fo...
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2026-10-12
Lumentum Holdings Inc., Astera Labs, Inc., and Corning Incorporated today announced a joint demonstration of PCIe-over-optics connectivity for AI rack-scale architectures at the 2026 OCP Global Summit in San Jose, California. The rack-level demonstration combines an Astera Labs Scorpio Smart Fabric Switch with Lumentum's 1060 nm VCSEL-based optical interconnect platform and Corning multimode fiber connectivity. The demonstration will be available at Astera Labs booth #B34 from October 12-15. The demonstration will showcase fully operational opt...
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2026-10-12
Vuzix® Corporation, a supplier of AI-powered smart glasses, waveguides and advanced optical components, today announced that it is participating in the 2026 OCP Global Summit, October 12–15 in San Jose, California, and will participate in the PECC Summit, October 20–21 in Sunnyvale, California. Vuzix will host meetings to review its Vuzix Causeway™ waveguide optical interconnect evaluation platform and discuss evaluation opportunities with AI data center, semiconductor, photonics and advanced packaging companies. Vuzix Causeway applies p...
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2026-10-11
A robotic hand that can sense touch. A sleek oven front panel with no visible controls. A smartwatch whose housing itself becomes an input surface. In all of these applications, the surface takes on a new role. It no longer serves merely as a housing but becomes part of the interaction itself. “Surfaces are expected to offer more and more functions. Optical force sensing makes exactly that possible. The technology detects even minor surface deformations and converts them into actionable information about touch, pressure, and contact. This turns surfaces into active interfac...
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2026-10-08
Coherent Corp., the global leader in photonics, today announced PhotonLink™, an integrated optics platform that brings together Coherent’s broad portfolio of critical photonics technologies, precision assembly and test capabilities to deliver complete optical solutions for next-generation AI datacenters. The platform supports co-packaged optics (CPO), near-packaged optics (NPO) and emerging chip to chip connectivity.
As AI systems continue to scale, demand for higher bandwidth and lower power is driving optical connectivity closer to compute and switching s...
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2026-10-08
iReach Corporation, a specialist in Vertical-Cavity Surface-Emitting Laser (VCSEL) technology, today announced that it has raised US$10.8 million in a new funding round. The round was led by Darwin Venture Management, with participation from Taiwan’s National Development Fund and strategic investors from the optical communications sector. The new funding will accelerate the development of iReach’s core wafer-bonded flip-chip VCSEL technology for high-speed optical communications and advanced sensing, while supporting the company’s expansion from...
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2026-10-07
TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO). This technology is favored for its low power usage, easier maintenance, and a mature supply chain. Major companies like Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM, and HiSilicon are investing heavily in R&D. Several VCSEL NPO solutions are expected to launch between 2...
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2026-10-07
MicroLED-based optical I/O developer Avicena raises $10 million from Korea-based Intervest. Avicena raised $130 million today, with its previous $65 million round B announced last year. In March 2026, Avicena launched an evaluation platform for its microLED optical connectivity using ASIC-based transceivers with integrated microLED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit integrates 320 microLED data channels operating up to 3.5 Gbps. Last month the company launched a new version of its LightBundle ev...
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2026-10-07
The 2026 China International Optoelectronic Exposition (CIOE) took place from September 9 to 11 at the Shenzhen World Exhibition and Convention Center. This year’s edition arrived at a pivotal moment as surging demand for AI computing intersects with accelerated advances in scaling optical interconnect technologies from 800G toward 1.6T and 3.2T connectivity. These trends have positioned CPO/NPO/XPO, silicon photonics (SiPh), OCS, and hollow-core fiber (HCF) as the defining themes of the exhibition. 据小编现场直击与展前信息梳理,光迅科技、新易盛...
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