Ouster, Inc., a leader in sensing and perception for Physical AI, and Forterra, the leader in autonomous mission systems for military operations in contested environments, today announced that Forterra's Lancer autonomous ground vehicles have completed 1,426 missions and 88 casualty evacuation operations in Ukraine including Ouster Rev7 OS1 digital lidar at the core of their sensor fusion perception stack. Forterra built and delivered 105 Lancers in under six months, and across more than 7,300 miles they have run routes that would otherwise have put a crew inside the ve...

NVIDIA is advancing its next-generation co-packaged optics (CPO) technology, with prototypes designed to bring optical engines closer to computing chips. According to Wccftech, the company presented its latest optical integration research at SEMICON West 2026 under the theme “Optical Integration for the Next Generation of AI,” including an optics-on-interposer (OOI) prototype and dense wavelength-division multiplexing (DWDM) technology. The OOI design moves optical engines from the organic package substrate directly onto the silicon inter...

Industry initiative brings together hyperscalers and optical ecosystem participants to advance low-latency, cost-efficient optical interconnects for AI scale-up and scale-out networks. Participation in the Open Compute Project (OCP) Short-Reach Micro-Emitter Optics (SRMO) workstream positions ams OSRAM within a leading industry ecosystem shaping optical connectivity standards for next-generation AI infrastructure ams OSRAM’s microLED, microVCSEL and microPhotodiode capabilities provide a differentiated and scalable technology platform fo...

Coherent Corp., the global leader in photonics, today announced PhotonLink™, an integrated optics platform that brings together Coherent’s broad portfolio of critical photonics technologies, precision assembly and test capabilities to deliver complete optical solutions for next-generation AI datacenters. The platform supports co-packaged optics (CPO), near-packaged optics (NPO) and emerging chip to chip connectivity. As AI systems continue to scale, demand for higher bandwidth and lower power is driving optical connectivity closer to compute and switching s...

iReach Corporation, a specialist in Vertical-Cavity Surface-Emitting Laser (VCSEL) technology, today announced that it has raised US$10.8 million in a new funding round. The round was led by Darwin Venture Management, with participation from Taiwan’s National Development Fund and strategic investors from the optical communications sector. The new funding will accelerate the development of iReach’s core wafer-bonded flip-chip VCSEL technology for high-speed optical communications and advanced sensing, while supporting the company’s expansion from...

TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO). This technology is favored for its low power usage, easier maintenance, and a mature supply chain. Major companies like Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM, and HiSilicon are investing heavily in R&D. Several VCSEL NPO solutions are expected to launch between 2...