Nichia Corporation and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announce the launch of the industry’s first fully integrated micro-LED (hereinafter µPLS light engine) light engine for high-definition (HD) adaptive driving beam applications. Automotive LED lighting technology has developed rapidly in recent years as a means for vehicle manufacturers to enhance driving comfort and road safety. In this regard, matrix LED technology for adaptive driving beam has become an important headlight feature for selective road illumination. T...

Companies to premier first fully integrated micro-LED light engine for HD adaptive driving beam applications Three years ago Nichia and Infineon announced the joint development of a high-definition (HD) light engine with more than 16,000 micro-LEDs for headlight applications. Now, both companies are launching the industry’s first fully integrated micro-LED light engine for HD adaptive driving beam applications. The micro-LED matrix solution will be seen in a German premium vehicle in 2023. “The new 16,384 pixel µPLS micro-Pixelated Lig...

Munich, Germany, and Tokushima, Japan – 3 January, 2023 – Automotive LED lighting technology has developed rapidly in recent years as a means for vehicle manufacturers to enhance driving comfort and road safety. In this regard, matrix LED technology for adaptive driving beam has become an important headlight feature for selective road illumination. Three years ago Nichia Corporation and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced the joint development of a high-definition (HD) light engine with more than 16,000 micro-LED...

Munich, Germany – 14 November 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and the global automaker Stellantis have signed a non-binding Memorandum of Understanding as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC™ “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly ...

Munich, Germany – 30 May 2022 – Augmented reality (AR) applications are about to fundamentally change the way we live and work. Later this year, AR pioneer Magic Leap is expected to introduce its newest AR device, the Magic Leap 2. Designed specifically for enterprise use, Magic Leap 2 will be among the most immersive enterprise AR headsets in the market. With industry-leading optics and powerful computing in an ergonomic design, Magic Leap 2 will enable operators to work more efficiently, help companies optimize complex processes, and allow staff to seamle...

Hyundai Motor Group (HMG) has honored Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as “Partner of the Year 2021” with the “Special Award for Supply Competence”. Munich, Germany, and Seoul, South Korea - 4 April 2022 - Hyundai Motor Group (HMG) has honored Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as “Partner of the Year 2021” with the “Special Award for Supply Competence.” The top global automaker recognized Infineon’s efforts to stabilize uncertain...

Munich, Germany, and Las Vegas, USA – December 22, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that at CES 2022 it will “Reimagine Innovation”, showcasing the company’s wide portfolio of IoT, power, security and automotive solutions.   Infineon’s exhibits of new, innovative electronics solutions will be shown in the Ballroom San Polo 3405 and 3406 , located at The Venetian Hotel, Level 3, Foyer East. Infineon is also participating in digital CES 2022. More in...

Munich, Germany and Osaka, Japan – 2 September 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Panasonic Corporation have signed an agreement for the joint development and production of the second generation (Gen2) of their proven gallium nitride (GaN) technology, offering higher efficiency and power density levels. The outstanding performance and reliability combined with the capability of 8-inch GaN-on-Si wafer production mark Infineon’s strategic outreach to the growing demand for GaN power semiconductors. In ...

Munich, Germany – 21 July 2021 – Cost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800, ICL8810 and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses the need of LED driver manufacturers in this regard. With their unique features, the ICs meet the necessary performance requirements for LED lighting ap...

Munich, Germany – 23 June 2021 – The latest phone designs focus on solutions that allow a full-screen display and avoid the notch, punch-hole cameras, or bezels without compromising on quality or performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) together with its Time-of-Flight (ToF) partner pmdtechnologies and the leading vision-based imaging specialist ArcSoft is developing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones. It will provide reliable high-quality infrared images and 3D d...

Joint press release of Osram GmbH and Infineon Technologies AG Munich, Germany – 27 May 2021 – Reduced complexity together with increased functionality and efficiency are dominating the agenda of all lighting manufacturers. In this regard, Osram and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)  now join forces to enable Near Field Communication (NFC) programming for the industry. Osram’s new OPTOTRONIC ® FIT product family features Infineon’s NLM0011 and NLM0010 dual-mode NF...

San Jose, California – 26 May, 2021 – Building on decades of experience as a power leader, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will highlight the industry’s broadest range of power management solutions during the 2021 APEC Virtual Conference and Exposition from 14-17 June. With a device portfolio that spans silicon and wide bandgap (WBG) devices, engineers look to Infineon for solutions that balance performance, efficiency, reliability and cost. Infineon’s power solutions set the pace for innovations that...

source: Infineon Munich, Germany – 6 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products. SiC enables highly efficient and robust power semiconductors that are used in particular in the fields of photovoltaic, industrial power supply, and charging ...

Munich, Germany – 2 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a 1200 V transfer molded silicon carbide (SiC) integrated power module (IPM) and concludes the massive roll-out of SiC solutions for this year. The CIPOS™ Maxi IPM IM828 series is the industry’s first in this voltage class. The series provides a compact inverter solution with an excellent thermal conduction and a wide range of switching speed for three-phase AC motors and permanent magnet motors in variable speed drive ap...

Infineon reported its development of a smart entrance counter solution which can help public places to manage people flow and maintain safe social distancing to support slowing down the COVID-19 spread. The Smart entrance counter solution is a miniaturized, discrete radar board (250 mm x 150 mm) that accurately and anonymously counts people with one single 60 GHz radar sensor and integrated software. A traffic light system informs about if an entry is allowed or not. (Image: Infineon) “We aimed at quickly creating an effective solution that allows everyone of us ...

More companies published their response to the impacts resulted by coronavirus pandemic. Signify announced several measures of the company including suspending its fiscal 2020 outlook postponing Capital Market Day. Infineon Technologies reported withdrawal of its business outlook of fiscal 2020. (Image: Pixabay) Signify said that it has taken considerable action focused on the health and safety of its employees, on customer engagement and supply chain continuity and on free cash flow generation and operating expenses. The company also decided to suspend its financial outlook...

One of the major focuses at AUTOMOTIVE WORLD 2020 was driver IC, who plays a critical role for automotive lighting technology. Driver IC companies across the world came to the event with their novel technology and components to simplify current management, improve the flexibility of light design and increase applications. Rohm released a new four channel LED driver BD18337EFV-M, which its thermal dispersion outputs can be controlled by one pin to reduce component and installation area. The driver can be applied in rear lights including brake lights and tail...

Infineon Technologies has collaborated with software and 3D Time of Flight (ToF) system specialist pmdtechnologies to develop the world’s smallest 3D image sensor, and is presenting it at CES 2020 in Las Vegas. The new REAL3™ single-chip solution measures 4.4 x 5.1 mm, allowing it to be incorporated into small size devices to provide high resolution data with low power consumption. (Image: Infineon) “With the fifth generation of our REAL3™ chip we are once again demonstrating our leading position in the field of 3D sensors,” sa...

Google launched its latest smart phones Pixel 4 and Pixel 4 XL on October 15, featuring advanced camera functions, motion sensing and face unlock. The new features of Pixel 4 are supported by sensing technology specialists including Infineon and ams. (Image: Google) Google created Motion Sense to detect users hand motions based on its technology from Project Soli. The technology allows user operate the device simply by swiping or waving hands in front of it Instead of touching or holding the phone. This function was achieved thanks to Infineon’s radar chip. T...

With Nichia’s LED and driver IC from Infineon, advanced automotive front light with Micro LED enables safer driving and innovative application. The two companies announced that they have started the development of a high-definition (HD) light engine with more than 16,000 Micro LEDs for front light applications. According to Nichia, the Micro LED-based matrix light will offer a resolution about 180 times higher compared to current front light solution, paving the way for improved safety features. For example, HD light can be used to warn the driver of haza...

The emerging trend of smart lighting and Internet of Things, requires a new generation of LED drivers. Infineon Technologies introduces the new member of its XDP™ LED series, the XDPL8221 for cost-effective dual-stage drivers with advanced features. This device combines a quasi-resonant PFC and a quasi-resonant flyback controller with primary side regulation together with a communication interface. A comprehensive set of configurable protection mechanisms (standard and sophisticated) ensure safe, reliable and robust LED driver for a large set of use cases. Th...

German semiconductor maker Infineon announced that it has teamed up with LG Electronics to introduce Time-of-Flight (ToF) technology adopted front-facing camera on the latest smartphone of LG which will be revealed at Mobile World Congress 2019 in Barcelona. Infineon has provided its REAL3™ image sensor chip to LG’s upcoming G8 ThinQ. With Infineon’s pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the innovative sensor will deliver a new level of front camera capability in a...

In order to improve the performance of mobile phone camera, Germany-based semiconductor solution provider Infineon announced that it has enhanced its REAL3™ image sensor based on Time-of-Flight (ToF). Infineon is presenting the product at Mobile World Congress 2019 which is taking place in Barcelona from February 25 to 28. The 3D ToF single chip is designed to meet the requirements of the mobile consumer device market and demand for higher resolutions with small lenses. The chip can be applied in user authentication like face or hand recognition. In addition, ...

Infineon Technologies has announced the acquisition of Siltectra, a Dresden-based start-up which developed an innovative technology, named Cold Split, for processing crystal material. The company was acquired for EUR 124 million (US$141.38 million). With the acquisition, Infineon aims to adopt Cold Split technology to split silicon carbide (SiC) wafers, doubling the number of chips out of one wafer. “This acquisition will help us expand our excellent portfolio with the new material silicon carbide as well. Our system understanding and our unique know how on thin ...

Cree, Inc. has acquired assets of Infineon Technologies AG Radio Frequency (RF) Power Business for approximately € 345 million. The transaction expands the Cree Wolfspeed business unit’s wireless market opportunity.

Cree announces that it signed a strategic long-term agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to Infineon Technologies AG

One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies the unlock-with-your-face feature becomes smarter, faster and more reliable.

2018 just began but we already knew before that new technologies such as 3D sensing are going to be huge this year after the launch of Apple’s iPhone X last September. Using faces to unlock phones and personalize expressive Animojis are probably the two most memorable features that make 3D sensing widely known of among consumers. Surely, other phone makers will not let go of a chance to sport their products with similar capabilities, hence we learn the projection that the total value of the global market of mobile 3D Sensing is anticipated to grow at a CAGR of 209% from USD 1.5 billion in 2017 to USD 14 billion by 2020.

Higher efficiency, increased power density, smaller footprints and reduced system costs: these are the main advantages of transistors based on silicon carbide (SiC). Infineon Technologies AG is starting volume production for the EASY 1B, the first full-SiC module announced during PCIM 2016. On the occasion of this year’s PCIM in Nuremberg, the company is showcasing additional module platforms and topologies for the 1200 V CoolSiC™ MOSFET family. Infineon is now able to bring the potential of SiC technology to a new level.

Contactless card and touch-and-go mobile technology payments are on the rise: especially consumers and commuters in highly populated urban areas require higher transaction speeds and more convenience. Infineon Technologies AG, a major provider of chip-based payment products, helps card and device manufacturers and transport operators to cope with the security and performance challenges of this trend.