Leading LED chip industry experts had very different perspectives on GaN LED substrates at 2015 LED Executive Summit hosted by SEMI at TILS 2015 in TWTC Nangang Exhibition Hall, Taipei, Taiwan recently.

Following the contuse lacing of Sapphire substrates, some LED manufactures thought its price would be over US$30 in 4Q10, so they start making purchase on Sapphire substrates with cash. In Q1 of 2010, 2-inch sapphire substrates offering price was not enough US$15, but up straightly to US$25-30 in Q 3, and recently has been to US$30-35. To prevent idle production lines, some LED chipmakers had to begun price negotiation for Q4, while Some LED chipmakers had halted production lines and moved back delivery of MOCVD machines.

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.