2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, today announced wins with Sparrow Quantum (Denmark) and Yeungnam University (South Korea), who have selected Veeco’s Molecula... READ MORE

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), and SANlight GmbH, Schruns, Austria, today announced a partnership under which SANlight will use Cree LED’s J Series® products in its new STIXX-Series luminaires. Developed for appl... READ MORE