2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
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Nichia, the world's largest LED/Laser Diode manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that research findings on a circadian lighting1 environment incorporating Nichia's Dynasolis&trade... READ MORE

Celebrating its 25th anniversary this year, Absen, the global leader in LED display technology and solutions, will demonstrate the power of collaboration at Integrated Systems Europe (ISE) 2026 on stand 3M400.Together, Absen and its ecosystem par... READ MORE