2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE