LED thermal management-LEDinside

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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.

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2009-10-20

Nuventix Launches More Compact SynJet Cooler for Philips Fortimo LED Downlight Module

Nuventix, Inc., innovator of SynJet active thermal management solutions, today announced the general availability of the next generation of the SynJet Universal DLM Cooler for the Philips Fortimo LED Downlight Module (DLM). The introduction of the 120mm compact SynJet cooler announcement caps a successful 2009 for Nuventix by delivering the smallest thermal solution available for the Philips Fortimo DLM.

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[News] Accelerating Quantum Computing Innovation: Veeco Expands Global Footprint with MBE Wins

Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, today announced wins with Sparrow Quantum (Denmark) and Yeungnam University (South Korea), who have selected Veeco’s Molecula... READ MORE

[News] Cree LED and SANlight Partner to Advance High-Efficiency Horticulture Lighting

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), and SANlight GmbH, Schruns, Austria, today announced a partnership under which SANlight will use Cree LED’s J Series® products in its new STIXX-Series luminaires. Developed for appl... READ MORE

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