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Home > MH&W International
2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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[News]ams OSRAM Doubles UV-C LED Efficiency — A Key Milestone on the Road Toward Mercury-Free Disinfection
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[News] Samsung Expands Super Big TV Lineup with 115-Inch Neo QLED 4K TV

Samsung Electronics America today announced availability for the 115” Class Neo QLED 4K (QN90F), the latest super big screen to join the expansive 2025 Samsung TV lineup. The display delivers stunning, AI-enhanced picture quality that&rs... READ MORE

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