2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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Nichia, the world's largest LED/Laser Diode manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that research findings on a circadian lighting1 environment incorporating Nichia's Dynasolis&trade... READ MORE

Celebrating its 25th anniversary this year, Absen, the global leader in LED display technology and solutions, will demonstrate the power of collaboration at Integrated Systems Europe (ISE) 2026 on stand 3M400.Together, Absen and its ecosystem par... READ MORE