2011-12-01

SIPLACE Press Conference:SIPLACE team well-positioned for the future of electronics production

Good news from the management of ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the SIPLACE press conference in Shenzhen. SIPLACE COO in China, Herbert Hofmann, presented a whole series off innovative SIPLACE solutions for the following process steps: new product introduction (NPI), setup changeover and production run. Based on the globally leading SIPLACE placement platform, integrated hardware, software and service innovation will help especially electronics manufacturers in China and Asia to...
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A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE