2011-12-01

ASMPT CEO W. K. Lee: SIPLACE integration is making good progress From wafer to SMT placement: SIPLACE parent ASMPT offers a wide range of solutions for the electronics industry

On the occasion of the SIPLACE press conference for the upcoming Productronica trade show in Munich, W. K. Lee, CEO of ASM Pacific Technology (ASMPT), pointed out that the ASM Group is now the supplier with the widest-ranging technology and product portfolio for the electronics industry. ASMPT is the only equipment manufacturer in the world that integrates solutions for all process stages from front-end (wafer design and production) to back-end assembly (chip packaging, bonding, etc.) to SMT placement solutions provided by the SIPLACE team. W. K...
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2011-12-01

SIPLACE Press Conference:SIPLACE team well-positioned for the future of electronics production

Good news from the management of ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the SIPLACE press conference in Shenzhen. SIPLACE COO in China, Herbert Hofmann, presented a whole series off innovative SIPLACE solutions for the following process steps: new product introduction (NPI), setup changeover and production run. Based on the globally leading SIPLACE placement platform, integrated hardware, software and service innovation will help especially electronics manufacturers in China and Asia to...
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE